Occam process is a high technology process that is employable for the manufacturing of printed circuit boards and it can provide high-quality results to the customers. The significance of the process is that it is completely solder-free, which means that in order to connect the components on the printed circuit board, no soldering is required as the product can be easily placed in their slots on the boards and they remain firm in their place for a longer period. Similarly, another important benefit of the process is that it is completely safe and RoHS certified, which means that the products provide great value to the customers.
There are a number of different processes and steps involved in the manufacturing of printed circuit board using the Occam process and in this article, we will explain the most important steps in order to guide the readers and enable them to implement similar solutions in their manufacturing. Some of the common steps involved in the process are given below:
- In the first step, the components first place on an adhesive layer, which can be temporary or permanent depending upon the requirements of the users as well as the design parameters that have been selected.
- In the next step, the components are kept firm in their place in the insulating material and the assembly is inverted so that standard results can be achieved.
- In the third step, the layer is cut so that the components are easy to be placed in their specific holes in the printed circuit boards.
- When the components have been placed in their place then the adhesive material will keep them there and no soldering will be required for a longer period as long as the product has to operate.
- In the last step, a conformal coating can be applied on the boards in order to keep them safe from the external environment.
The Occam process provides get value to the customer’s but it is more expensive as compared to the normal processes, therefore, the use of Occam process is not common.